SAE ARP1332 Wave Soldering Procedure
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Product Code:SAE ARP1332
Title:Wave Soldering Procedure
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
Title:Wave Soldering Procedure
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope:The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
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